19th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC 2013)

Raad, P E [szerk.]; Rencz, M [Kerecsen Istvánné Rencz, Márta (Mikroelektronika), szerk.] Elektronikus Eszközök Tanszéke (BME / VIK); Wunderle, B [szerk.]; Poppe, A [Poppe, András (Mikroelektronika), szerk.] Elektronikus Eszközök Tanszéke (BME / VIK)

Angol nyelvű Konferenciakötet (Könyv) Tudományos

Megjelent: Institute of Electrical and Electronics Engineers (IEEE), New York, Amerikai Egyesült Államok, 389 p. 2013

Konferencia: 19th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC'13 2013-09-25 [Berlin, Németország]

Azonosítók

MTMT: 2434061
ISBN: 9781479922710
Egyéb URL: http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=6662496

Fejezetek

Plesz B et al. Investigation of the thermal behaviour of thin crystalline silicon solar cells. (2013) Megjelent: 19th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC 2013) pp. 15-20
Gergely Nagy et al. Practical aspects of thermal transient testing in live digital circuits. (2013) Megjelent: 19th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC 2013) pp. 87-91
Bíró Ferenc et al. Optimisation of Low Dissipation Micro-hotplates – Thermo-mechanical Design and Characterisation. (2013) Megjelent: 19th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC 2013) pp. 116-121
Maroua Garci et al. Lifetime of CMOS Circuits Evaluation by Means of Electro-thermal Simulations. (2013) Megjelent: 19th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC 2013) pp. 122-126
János Mizsei et al. Thermal-Electronic Integrated Logic. (2013) Megjelent: 19th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC 2013) pp. 128-134
Schweitzer D. Thermal transient characterization of semiconductor devices with multiple heat sources-Fundamentals for a new thermal standard. (2013) Megjelent: 19th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC 2013) pp. 128-134
Federica Lidia Teresa et al. Convolution Based Compact Thermal Model for 3D-ICs: Methodology and Accuracy Analysis. (2013) Megjelent: 19th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC 2013) pp. 152-157
Cheikh Tidiane Dia et al. Dynamic Sub-Compact Model and Global Compact Model Reduction for Multichip Components. (2013) Megjelent: 19th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC 2013) pp. 158-162
Codecasa L. Novel Approach to Compact Modeling for Nonlinear Thermal Conduction Problems. (2013) Megjelent: 19th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC 2013) pp. 164-169
P Anithambigai et al. Study on Thermal Performance of High Power LED Employing Aluminium Filled Epoxy Composite as Thermal Interface Material. (2013) Megjelent: 19th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC 2013) pp. 181-186
Krzysztof Górecki. The Influence of Mutual Thermal Interactions Between Power LEDs on Their Characteristics. (2013) Megjelent: 19th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC 2013) pp. 188-193
Xavier Jord et al. Influence of Different Characterization Parameters on the Accuracy of LED Board Thermal Models for Retrofit Bulbs. (2013) Megjelent: 19th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC 2013) pp. 194-199
Janicki M et al. Impact of Nonlinearities in Boundary Conditions on Device Compact Thermal Models. (2013) Megjelent: 19th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC 2013) pp. 202-205
Greco Giuseppe et al. Generation of Electro-Thermal Models of Integrated Power Electronics Modules Using a Novel Synthesis Technique. (2013) Megjelent: 19th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC 2013) pp. 216-221
Zoltan Sarkany et al. Failure prediction of IGBT modules based on power cycling tests. (2013) Megjelent: 19th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC 2013) pp. 270-273
Sander Noijen et al. Integrating Advanced Interconnect Technologies in a High Power Lighting Application: First Steps. (2013) Megjelent: 19th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC 2013) pp. 276-280
Zanden Carl et al. Fabrication and Characterization of a Metal Matrix Polymer Fibre Composite for Thermal Interface Material Applications. (2013) Megjelent: 19th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC 2013) pp. 286-292
Enikő Bándy et al. The Effect of Heat Treatment on Spin-On Oxide Glasses in Solar Cell Application. (2013) Megjelent: 19th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC 2013) pp. 297-300
Gy. Bognár et al. Thermal model generalization of infrared radiation sensors. (2013) Megjelent: 19th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC 2013) pp. 301-304
Ferenc Ender et al. Thermal Characterization of Multichip Structures. (2013) Megjelent: 19th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC 2013) pp. 319-322
Gorecki K et al. The Compact Thermal Model of the Pulse Transformer. (2013) Megjelent: 19th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC 2013) pp. 323-326
A. Timar et al. Logi-thermal simulation using high-resolution temperature dependent delay models. (2013) Megjelent: 19th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC 2013) pp. 376-380

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19th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC 2013)

Raad, P E [szerk.]; Rencz, M [Kerecsen Istvánné Rencz, Márta (Mikroelektronika), szerk.] Elektronikus Eszközök Tanszéke (BME / VIK); Wunderle, B [szerk.]; Poppe, A [Poppe, András (Mikroelektronika), szerk.] Elektronikus Eszközök Tanszéke (BME / VIK)

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